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https://hdl.handle.net/2440/137819
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Type: | Journal article |
Title: | Quantization-Based Event-Triggered Consensus of Multiagent Systems Against Aperiodic DoS Attacks |
Author: | Zhang, Y. Wu, Z.G. Shi, P. Huang, T. Chakrabarti, P. |
Citation: | IEEE transactions on systems, man, and cybernetics. Systems, 2023; 53(6):1-10 |
Publisher: | Institute of Electrical and Electronics Engineers (IEEE) |
Issue Date: | 2023 |
ISSN: | 2168-2216 2168-2232 |
Statement of Responsibility: | Yifang Zhang, Zheng-Guang Wu, Peng Shi, Tingwen Huang, and Prasun Chakrabarti |
Abstract: | This article focuses on the secure consensus problem of linear multiagent systems (MASs) with quantized eventtriggered control (ETC) against denial-of-service (DoS) attacks. DoS attacks with constrains on frequency and duration are discussed, which intend to block the communication links between agents to destroy the consensus. Due to the limited transmission capacity and communication resources, a uniform quantizer and an event-triggered mechanism (ETM) are considered to economize energy consumption. An ETC protocol based on the quantized relative state is designed to resist malicious DoS attacks. Then, sufficient conditions to guarantee the practical consensus of MASs are derived with finite data transmission rates, and the tolerance of DoS attack frequency and duration are given. The Zeno behavior does not exhibit by proving that lower positive bounds exist for all agents, indicating the feasibility of the proposed ETM. Finally, two simulation examples are given to verify the validity and superiority of the theoretical results. |
Keywords: | Consensus; denial-of-service (DoS) attacks; multiagent systems (MASs); quantized event-triggered control (ETC) |
Description: | Published June 2023 |
Rights: | © 2023 IEEE. Personal use is permitted, but republication/redistribution requires IEEE permission. See https://www.ieee.org/publications/rights/index.html for more information. |
DOI: | 10.1109/TSMC.2022.3232413 |
Published version: | http://dx.doi.org/10.1109/tsmc.2022.3232413 |
Appears in Collections: | Electrical and Electronic Engineering publications |
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