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|Title:||Detection of cracks using piezoelectric wafer active sensors|
|Citation:||Key Engineering Materials, 2005; 293-294:201-206|
|Publisher:||Trans Tech Publications|
|Antoni Blazewicz, Andrei Kotousov and Frank Wornle|
|Abstract:||Abstract. The capability of piezoelectric wafer active sensors to identifying cracks which are common to metallic structural elements subjected to fatigue loading were explored. A number of laboratory tests were performed to investigate Lamb wave transmission and reception characteristics as well as the sensitivity of the transmitted and reflected signals to the presence of a through-the-thickness crack of various length and orientation in a thin plate. Based on the laboratory tests an optimum strategy for crack detection with the pulse-echo method was investigated. The method can be used for large areas scanning with a small amount of sensors and is favoured for embedded and leave-in-place sensor applications.|
|Keywords:||Crack detection; Lamb waves; echo-pulse method; sensor measurement strategies; piezoelectric wafer sensors|
|Description:||© (2005) Trans Tech Publications|
|Appears in Collections:||Mechanical Engineering publications|
Materials Research Group publications
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