Please use this identifier to cite or link to this item: https://hdl.handle.net/2440/134067
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Type: Conference paper
Title: Pulse shaping for IEEE 802.15.3d standard compliant terahertz communications
Author: Shehata, M.
Wang, K.
Webber, J.
Masayuki, F.
Nagatsuma, T.
Withayachumnankul, W.
Citation: Proceedings of the Third International Workshop on Mobile Terahertz Systems (IWMTS 2020), 2020, pp.1-5
Publisher: IEEE
Publisher Place: online
Issue Date: 2020
ISBN: 9781728155982
Conference Name: 2020 Third International Workshop on Mobile Terahertz Systems (IWMTS) (1 Jul 2020 - 2 Jul 2020 : Essen, Germany)
Statement of
Responsibility: 
Mohamed Shehata, Ke Wang, Julian Webber, Fujita Masayuki, Tadao Nagatsuma, Withawat Withayachumnankul
Abstract: The IEEE 802.15.3d Standard for point-to-point wireless links in the low-terahertz band calls for judicious pulse shape designs in order to achieve interoperability and interference-free among multiple users. Motivated by these considerations, we propose, a frequency-domain waveform design approach that considers the spectral constraints defined by the IEEE 802.15.3d Standard. The proposed waveform shows full compliance with the spectral mask requirements as well as outperforming a typical raised cosine waveform, in terms of the sidelobe level, by about 30 dB. Preliminary results are demonstrated experimentally with a photonics-enabled terahertz communication system. A bit error rate performance of less than 10 -3 is achieved using uncoded wireless transmission at 1.44 Gbps. This error rate is reducible to less than 10 -15 if forward error correction codes are employed. The proposed waveform design approach is potentially simple and cost-effective for implementation in the baseband by using finite impulse response filters.
Keywords: Compliance; IEEE 802.15.3d-2017 Standard; pulse shaping; terahertz
Description: Date Added to IEEE Xplore: 13 August 2020
Rights: ©2020 IEEE
DOI: 10.1109/IWMTS49292.2020.9166430
Grant ID: http://purl.org/au-research/grants/arc/DP180103561
Published version: https://ieeexplore.ieee.org/xpl/conhome/9160908/proceeding
Appears in Collections:Electrical and Electronic Engineering publications

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